Make tarball of postscripts

diff --git a/pcb/Makefile b/pcb/Makefile
index 76d4555860b59a1718f64aa6b950c57cf1e7ccb3..d6b297deb948118cebe06056433e9fb19880946b 100644 (file)
--- a/pcb/Makefile
+++ b/pcb/Makefile
@@ -63,7 +63,7 @@ include panel3.layers.dep
                        m/^(\S+)\s+(\w+)\s+(\w+)\s+(\S.*)$$/ or die;    \
                        system "cp ../$*.pcb.output_$$1.$$3 $$2.$$3";   \
                        die $$? if $$?;                                 \
-                       $$_= sprintf "%-20s %s\n", $$2.$$3, $$4;        \
+                       $$_= sprintf "%-20s %s\n", "$$2.$$3", $$4;      \
                ' >readme.txt;                                          \
                zip -l ../$@.new *
                mv -f $@.new $@
@@ -76,6 +76,9 @@ panel3.pcb:   pcb-panelise $(PANEL3_PCBS) Makefile
 
 $*.zip: $*.pcb.output_$$1.$$2/ or die' \
 
+%.out-ps.tar:
+               GZIP=-9v tar zvcf $@.gz $*.pcb.output_*.ps
+
 %.layers.dep:  layers.txt.tmpl Makefile
                perl -pe \
        's/^(\S+)\s+\w+\s+(\w+)\s.*/$*.zip: $*.pcb.output_$$1.$$2/ or die' \

diff --git a/pcb/panel3.out-ps.tar.gz b/pcb/panel3.out-ps.tar.gz
index d2e7c260828613474c796f55d377ab78e232abea..c926194b27046b010004d66bd265c90cc32e567f 100644 (file)
Binary files a/pcb/panel3.out-ps.tar.gz and b/pcb/panel3.out-ps.tar.gz differ

diff --git a/pcb/panel3.zip b/pcb/panel3.zip
index ecccef9357bef1c640749585dc33506b082efafd..d9d96c51a779a1edee64f6c93dfe1e76b9d070a8 100644 (file)
Binary files a/pcb/panel3.zip and b/pcb/panel3.zip differ

diff --git a/pic.make b/pic.make
index 76d4555860b59a1718f64aa6b950c57cf1e7ccb3..d6b297deb948118cebe06056433e9fb19880946b 100644 (file)
--- a/pic.make
+++ b/pic.make
@@ -63,7 +63,7 @@ include panel3.layers.dep
                        m/^(\S+)\s+(\w+)\s+(\w+)\s+(\S.*)$$/ or die;    \
                        system "cp ../$*.pcb.output_$$1.$$3 $$2.$$3";   \
                        die $$? if $$?;                                 \
-                       $$_= sprintf "%-20s %s\n", $$2.$$3, $$4;        \
+                       $$_= sprintf "%-20s %s\n", "$$2.$$3", $$4;      \
                ' >readme.txt;                                          \
                zip -l ../$@.new *
                mv -f $@.new $@
@@ -76,6 +76,9 @@ panel3.pcb:   pcb-panelise $(PANEL3_PCBS) Makefile
 
 $*.zip: $*.pcb.output_$$1.$$2/ or die' \
 
+%.out-ps.tar:
+               GZIP=-9v tar zvcf $@.gz $*.pcb.output_*.ps
+
 %.layers.dep:  layers.txt.tmpl Makefile
                perl -pe \
        's/^(\S+)\s+\w+\s+(\w+)\s.*/$*.zip: $*.pcb.output_$$1.$$2/ or die' \

diff --git a/spice/Makefile b/spice/Makefile
index 76d4555860b59a1718f64aa6b950c57cf1e7ccb3..d6b297deb948118cebe06056433e9fb19880946b 100644 (file)
--- a/spice/Makefile
+++ b/spice/Makefile
@@ -63,7 +63,7 @@ include panel3.layers.dep
                        m/^(\S+)\s+(\w+)\s+(\w+)\s+(\S.*)$$/ or die;    \
                        system "cp ../$*.pcb.output_$$1.$$3 $$2.$$3";   \
                        die $$? if $$?;                                 \
-                       $$_= sprintf "%-20s %s\n", $$2.$$3, $$4;        \
+                       $$_= sprintf "%-20s %s\n", "$$2.$$3", $$4;      \
                ' >readme.txt;                                          \
                zip -l ../$@.new *
                mv -f $@.new $@
@@ -76,6 +76,9 @@ panel3.pcb:   pcb-panelise $(PANEL3_PCBS) Makefile
 
 $*.zip: $*.pcb.output_$$1.$$2/ or die' \
 
+%.out-ps.tar:
+               GZIP=-9v tar zvcf $@.gz $*.pcb.output_*.ps
+
 %.layers.dep:  layers.txt.tmpl Makefile
                perl -pe \
        's/^(\S+)\s+\w+\s+(\w+)\s.*/$*.zip: $*.pcb.output_$$1.$$2/ or die' \